AI hardware thermal management: Cooling optimization for a deep learning machine - 19 de mayo de 2022 - TecnoWebinars.com

Many different applications we see in our daily lives – virtual assistants like Siri and Alexa, facial recognition, self-driving cars heavily rely on deep learning and natural language processing.

 

Deep learning is emerging as one of the most important developments of this decade. It uses more neural network layers to simulate the human brains’ ability to learn. Using deep learning technologies, computers can be trained to accomplish specific tasks by processing large amounts of data and recognizing patterns in the data.

 

A chip designed specifically for deep learning offers significant advantages over a network of computers – more cores, optimized for AI, huge on-chip memory giving very low latency for lightning-fast processing. This dissipates a lot of heat that must be removed to ensure overall performance and avoid premature failures.

 

Join this webinar to learn how Electronic Cooling Solutions Inc – experts in thermal management- collaborated with Cerebras engineers to develop the cooling solution for the biggest chip ever built.

 

 

- Why liquid cooling was chosen instead of air cooling for this application.

- How the cold plate was designed using Simcenter Flotherm XT.

- How the overall design ensures each IC operates at close to the same target temperature, which is critical for optimal performance.

- The microchannel design that ensures each IC on the wafer gets the correct coolant flow.

- The use of a simulation and test strategy to underpin the fidelity of the simulations.

 

 

Guy Wagner:ELECTRONICS COOLING SOLUTIONS Director, ECS Rocky Mountain Office

 

Guy Wagner has over 45 years of R&D experience in the electronics industry. His experience includes: IC and system cooling and packaging technology, disk drive design, thermal design of computer systems, medical and aerospace equipment, telephone switching systems, and consumer electronic products. His expertise includes both electronics system cooling as well as cooling of IC packages. Guy has authored and presented more than 40 papers at international technical conferences and has 29 patents. Prior to joining ECS, Mr. Wagner was Chief Scientist at HP in Fort Collins and a Member of the Technical Staff as Bell Laboratories. Mr. Wagner received his MS in Mechanical Engineering at Iowa.