Building the infrastructure for holistic, end-to-end manufacturing - 27 de abril de 2021 - TecnoWebinars.comWebinar • Siemens Industry Software: Digital Manufacturing • Industria y Fabricación
Building the infrastructure for holistic, end-to-end manufacturingAgéndalo en tu calendario habitual ¡en tu horario!
Martes, 27 de abril de 2021, de 08.00 a 09.00 hs Horario de Ohio (US)
Webinar en inglés
Learn how the digital evolution is driving a digital manufacturing revolution
For millions of years, our minds and bodies have been evolving and adapting to dynamic environments. We've overcome the complex evolutionary fine-tuning process by continuously adapting to integrate into our surroundings.
As we transition further into this digital age, the question arises – can the digital ecosystem support us as the natural ecosystem did in the past?
How can we ensure that our electronic devices support the future needs of our bodies and minds? These are big questions that demand big picture, multidisciplinary answers.
Is end-to-end manufacturing the answer to today’s complex manufacturing landscape?
As we rely more heavily on electronic devices in our daily lives, we see them becoming more complex, highly customized, and innovative. Producing these types of devices today requires an entirely different, holistic approach.
Managing PCB production and box-build (assembly) as a holistic, end-to-end process gives manufacturers the opportunity to boost efficiency and shorten time-to-market. But how do manufacturers adapt and build a smart and agile end-to-end manufacturing process? What tools do they need to make it work?
How to better integrate electronics and mechanical assembly processes for a faster TTM
Traditionally, in manufacturing, there is a separation that exists between electronics and mechanical manufacturing elements. This separation creates siloes of data and disconnected processes – one company or location designs the product, produces the PCB, and another has the final product (box-build) assembly.
In this webinar, you will learn about overcoming one of the significant hurdles in taking a complex product from design into manufacturing. We'll dive into the challenges surrounding the intersection between electronics and mechanical assembly. We will also describe the holistic ways manufacturers can better prepare for this digital evolution.
Optimize PCB and mechanical assembly processes to reduce manufacturing defects
Managing printed circuit board (PCB) production and box-build (assembly) as a holistic, end-to-end process allows manufacturers to reduce manufacturing defects and boost efficiency to shorten time-to-market. Register for the webinar to learn how manufacturers can build a smart and agile end-to-end manufacturing process. Gain an understanding of the tools they need to make it work.
Oren Manor:Director of Electronics Manufacturing Business Development , Siemens Digital Industries Software
Oren Manor is the Director of Business Development for the Valor Division of Mentor, a Siemens business, responsible for Valor’s engineering and pre-production tools, partnerships and OEM engagements. Oren has over 15 years of experience in sales and marketing of embedded and industry software. Previously, he was the global sales and marketing director for Jungo’s embedded connectivity business unit which was acquired by NDS and Cisco. He was also the vice president, sales and marketing of Signature-IT, a SaaS cloud-based solution for configuring, pricing and quoting (CPQ) of heavy-industry mechanical products.
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